The Boren Fellowship application process involves an internal campus review and interview in order for applicants to receive institutional endorsement.

Application Timeline

First Deadline: November 17, 2023

Materials due:

 

Second Deadline: December 13, 2023

Materials due:

  • All application materials uploaded to the Boren application portal.
    • Polished draft of national security essay
    • Polished draft of public service essay
    • Study plan summary (250 words)
    • Language plans short answer (150 words)
    • Career plans short answer (100 characters)
    • [OPTIONAL] Research Abstract (300 words) and Research Methodology (300 words)
    • [OPTIONAL] Letter of affiliation for internship or research project

 

Third Deadline: January 10, 2024

Materials due:

  • letters of recommendation due (faculty must submit to Boren application portal)
  • complete application submitted on the Boren application portal

 

Final Deadline: January 24, 2024 at 4pm Central Time

Materials due:

  • submission of final application on the Boren application portal

 

Interested applicants should emailĀ grad-fellowships@uchicago.edu as early as possible to learn about the campus process and resources and begin preparing the application. Draft statements and short answer questions must be uploaded into the Boren application portal by December 13 in order to participate in the campus interview process. Completed applications are due on January 10, 2024.

Applicants who are unable to apply through the UChicago campus process may still apply to the Boren Fellowship directly.

NSEP Boren Fellowships provide up to $30,000 to U.S. graduate students to add an important international and language component to their graduate education through specialization in area study, language study, or increased language proficiency. Boren Fellowships support study and research inĀ areas of the world that are critical to U.S. interests, including Africa, Asia, Central & Eastern Europe, Eurasia, Latin America, and the Middle East.

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